Originally published at: Sony patent suggests PS6 will drop liquid metal cooling after PS5 APU failures - POCG.NET
A patent filing reported by Wccftech suggests Sony is planning a different cooling solution for the PlayStation 6, moving away from the liquid metal thermal interface material used in the PS5. That material was meant to keep the APU cool, but it has been linked to reports of leaks that fried APUs and motherboards across…